Investigation of the Flip-Chip Package With BCB Underfill for W-Band Applications
نویسندگان
چکیده
منابع مشابه
Reliability Evaluation of Warpage of Flip Chip Package with Some Kinds of Underfill Material
Currently, the flip chip package is one of the standard semiconductor packages in the world market. Also, there are variety of materials and configurations used in flip chip packages with further high performance or miniaturization. From the encapsulate materials point of view, many types of assembly methods are presently studied on a current standard process as well as novel proposed processes...
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Driven by the fast growing demand for smaller, faster, and higher I/O electronic devices, flip chip technology has attracted significant attention in the electronic packaging industry. Flip chip is a proven packaging technology due to its high performance, reduced form factor, and greater I/O density. In successful flip chip packaging, the underfill process plays an important role because it ca...
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ژورنال
عنوان ژورنال: IEEE Microwave and Wireless Components Letters
سال: 2014
ISSN: 1531-1309,1558-1764
DOI: 10.1109/lmwc.2013.2285213